Copper conductor composition

Details Copper conductor composition Copper conductor composition

1988-11-07

1990-03-06

Barr, Josephine

Compositions

Electrically conductive or emissive compositions

Free metal containing

252518, 252520, 106 113, 106 122, 106 123, H01B 106

Patent

active

049064045

ABSTRACT:
A copper conductor composition having an improved solderability as well as a good adhesion, which comprises a copper powder, an inorganic binder and a boride or silicide of a metal such as W, Mo, Ti, Ta, Nb or Cr. The solderability is kept on a good level even if the composition is subjected to a firing operation repeatedly.

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patent: 4323483 (1982-04-01), Rellick
patent: 4514321 (1985-04-01), Siuta
patent: 4521329 (1985-06-01), Siuta et al.
patent: 4540604 (1985-09-01), Siuta

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