Copper conductive composition for use on aluminum nitride substr

Details Copper conductive composition for use on aluminum nitride substr Copper conductive composition for use on aluminum nitride substr

1991-06-05

1992-11-24

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428457, 428688, 428901, 174250, 361397, B32B 900

Patent

active

051659867

ABSTRACT:
Aluminum nitride (AIN), due to its high thermal conductivity, is an attractive substrate material to the power hybrid market, (i.e., users employing circuits utilizing power semiconductors resulting in a great deal of heat being produced by the electronic device). In spite of its attractive thermal, mechanical and dielectric properties, AlN substrates generally afford certain drawbacks, the primary drawback being that many conductive compositions do not readily adhere to the surface. One of the more desirable conductors to utilize in conductive compositions when producing microcircuits is copper. In accordance with the present invention, a copper containing conductive composition is provided which affords excellent adhesion to AlN substrates. The conductive composition preferably comprises copper or a copper alloy, a glass binder, and cadmium oxide.

REFERENCES:
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patent: 4293451 (1981-10-01), Ross
patent: 4400214 (1983-08-01), Ogawa et al.
patent: 4406701 (1983-09-01), Yamaoka et al.
patent: 4476039 (1984-10-01), Hormadaly
patent: 4540673 (1985-09-01), Takeda et al.
patent: 4880567 (1989-11-01), Prabhu et al.
"Thermodynamic Considerations In The Thick-Film Metallization Of Aluminum Nitride Substrates", by M. G. Norton, Journal of Materials Science Letters 9 (1990) 91-93.

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