Compositions – Electrically conductive or emissive compositions – Free metal containing
Patent
1989-11-14
1991-09-03
Barr, Josephine
Compositions
Electrically conductive or emissive compositions
Free metal containing
252514, 524439, 524440, H01B 106
Patent
active
050452363
ABSTRACT:
A copper conductive composition comprising 100 parts by weight of spherical copper powder coated with silver as metal powder, 6 to 18 parts by weight of resol type phenolic resin containing a dimethylene ether bond in bonded formaldehyde by 5% or more, the molar ratio between the formaldehyde thereof and phenol thereof (formaldehyde/phenol) being 1.0 to 3.0, 0.05 to 1 parts by weight of dispersant, and 2 to 15 parts by weight of solvent. Therefore, an excellent conductivity and solderability of the cured film can be obtained.
REFERENCES:
patent: 3202488 (1965-08-01), Ehrreich et al.
patent: 4309457 (1985-01-01), Kawasumi et al.
patent: 4996005 (1990-02-01), Saito et al.
Hirosawa Maraki
Kurimoto Yoshiaki
Tsunaga Masayuki
Yuba Kazuaki
Barr Josephine
Gunei Chemical Industry Co., Ltd.
Mitsui Mining & Smelting Co.
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