Copper composites directly bonded to ceramics

Details Copper composites directly bonded to ceramics Copper composites directly bonded to ceramics

1995-11-06

1997-02-11

Zimmerman, John

Stock material or miscellaneous articles

All metal or with adjacent metals

Having composition, density, or hardness gradient

428627, 428632, 428629, 428469, B32B 1520, B32B 1504

Patent

active

056019327

ABSTRACT:
A ceramic member (52) is direct-bonded to a copper composite substrate by heating to diffuse copper to the surface of the copper composite substrate (56), oxidizing the copper composite substrate following heating, placing a ceramic member in contact with the resulting oxidized substrate, and forming a copper-copper oxide eutectic (54) at the interface between the copper composite substrate and the ceramic member by heating. The eutectic, upon cooling, forms a bond between the copper composite and the ceramic.

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patent: 4833004 (1989-05-01), Senda et al.
patent: 5126102 (1992-06-01), Takahashi et al.
patent: 5252147 (1993-10-01), Verhoeven et al.

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