Copper colloid and method of activating insulating surfaces for

Details Copper colloid and method of activating insulating surfaces for Copper colloid and method of activating insulating surfaces for

1987-12-10

1988-08-09

Wax, Robert A.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

C22C 900

Patent

active

047625600

ABSTRACT:
A copper colloid containing a minor amount of an ionizable palladium compound for use in activating non-conductive materials for subsequent electroplating.

REFERENCES:
patent: 3361580 (1968-01-01), Schneble et al.
patent: 3657002 (1972-04-01), Blodger et al.
patent: 3672923 (1972-06-01), Zeblisky
patent: 3958048 (1976-05-01), Donovan et al.
patent: 3993799 (1976-11-01), Feldstein
patent: 4228201 (1980-10-01), Feldstein
patent: 4239538 (1980-12-01), Feldstein
patent: 4259376 (1981-03-01), Feldstein

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