Copper-clad polyetherimide laminates with high peel strength

Details Copper-clad polyetherimide laminates with high peel strength Copper-clad polyetherimide laminates with high peel strength

1990-01-16

1994-11-15

Gallagher, John J.

Stock material or miscellaneous articles

Composite

Of metal

1563073, 156327, 156335, 4284735, 525 61, 525472, 525491, B32B 1508

Patent

active

053647033

ABSTRACT:
The present invention is directed to improving the peel strength of copper foil laminated to polyetherimide substrates which optionally are reinforced. The improvement in process comprises coating one side of the copper foil with an adhesive composition, placing the coated side of the copper foil in contact with pre-formed polyetherimide substrate, and heat-pressing the resulting build-up to form a cured laminate of improved peel strength. The adhesive composition utilized comprises a blend of a polyvinyl butyral resin; one or more resole resins, and an organic solvent. Heat-pressing conditions comprise a temperature ranging from about 450.degree. to 550.degree. F. and pressing conditions ranging from about 100 to 700 psi. Within this temperature/pressure range, the adhesive-coated copper foil mated with the pre-formed polyetherimide substrate yields desired peel strengths without inducing excessive flow of the polyetherimide substrate, i.e. maintaining a pre-desired thickness .+-.7.5%.

REFERENCES:
patent: 3450595 (1969-06-01), Salter et al.
patent: 4626474 (1986-12-01), Kim
patent: 4765860 (1988-08-01), Ueno et al.
patent: 4906515 (1990-03-01), Inoguchi
patent: 4927742 (1990-05-01), Kohm

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