Copper-clad MC4 unsaturated polyester resin

Stock material or miscellaneous articles – Composite – Of metal

Patent

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Details

428251, 428273, 525 42, 525 48, 525 49, B32B 1508, B32B 2736, C08G 6348, C08G 6391

Patent

active

053126912

ABSTRACT:
Metal foil laminates of an unsaturated polyester resin, MC4, characterized by high performance electrical, physical and mechanical properties and useful for electronic circuit boards, low impedence microwave boards and E.M.I.-R.F.I. shielding, and a process for preparing such a metal-clad laminate.

REFERENCES:
patent: 4318954 (1982-03-01), Jensen
patent: 4873274 (1989-10-01), Cummings et al.
patent: 4943474 (1990-07-01), Tsunemi et al.
patent: 4990397 (1991-02-01), Tsunemi et al.
patent: 5004639 (1991-04-01), Desai
patent: 5009949 (1991-04-01), Tanaka et al.
patent: 5077326 (1991-12-01), Shibata et al.
patent: 5091251 (1992-02-01), Sakumoto et al.
patent: 5126192 (1992-06-01), Chellis et al.
patent: 5127158 (1992-07-01), Nakano
patent: 5144742 (1992-09-01), Lucas et al.

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