Copper-clad laminate with prepreg of epoxy resin and aryl ester

Details Copper-clad laminate with prepreg of epoxy resin and aryl ester Copper-clad laminate with prepreg of epoxy resin and aryl ester

1997-11-04

1999-06-29

Sellers, Robert E.

Stock material or miscellaneous articles

Composite

Of epoxy ether

428251, 428261, 428416, 525481, 525508, 525527, 528100, 528103, B32B 1508, B32B 2704, C08G 5962

Patent

active

059166835

ABSTRACT:
A copper clad laminate is disclosed as being obtained by thermoforming a prepreg and a copper foil. As disclosed, the pre-preg (uncured) includes a substrate impregnated with an epoxy resin, an aryl ester compound and a curing agent. The copper-clad laminate has a low dielectric constant and a low dielectric loss tangent. It is suitable for a multilayer printed wiring board for high speed operation, especially at high-frequency region.

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