Copper clad laminate, multilayer printed circuit board and their

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...

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428462, B32B 1508

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active

055695450

ABSTRACT:
A copper clad laminate having a bonded side ensuring powerful adhesion between the copper foil and insulating layer, without providing protrusions on the copper foil or making roughing treatment or black treatment, by designing such a configuration that the copper foil has a metal layer on the side to be bonded with the insulating layer and the metal layer and insulating layer are cross-linked with each other by chemical bonds through sulfur atoms. Further, there is provided a multilayer printed circuit board which has a bonded side ensuring a powerful adhesion of the circuit copper foil and insulating layer, by designing such a configuration that the alternating metal layers and insulating layers are cross-linked with each other by chemical bonds through sulfur atoms.

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