Copper-clad laminate and printed wiring board

Details Copper-clad laminate and printed wiring board Copper-clad laminate and printed wiring board

1995-07-11

1996-08-13

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428343, 428344, 428901, 216 20, 156233, B32B 900

Patent

active

055454666

ABSTRACT:
The present invention provides a copper-clad laminate characterized in that an electrolytic copper foil on the glossy (shiny) surface side of which a copper electrodeposit is formed, is bonded at its glossy surface side to one side or each of both sides of a substrate, which has a fine-pitch wiring (circuit) pattern and exhibits a high etching factor. The present invention further provides a copper-clad laminate which can be suitably employed in the production of such a printed wiring board.

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