Copper-clad laminate and printed wiring board

Details Copper-clad laminate and printed wiring board Copper-clad laminate and printed wiring board

1993-10-26

1995-08-01

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428343, 428344, 428901, 216 20, B32B 900

Patent

active

054379148

ABSTRACT:
The present invention provides a copper-clad laminate characterized in that an electrolytic copper foil on the glossy surface side of which a copper electrodeposit is formed, is bonded at its glossy surface side to one side or each of both sides of a substrate, which has a fine-pitch wiring (circuit) pattern and exhibits a high etching factor. The present invention further provides a copper-clad laminate which can be suitably employed in the production of such a printed wiring board.

REFERENCES:
patent: 3171756 (1965-03-01), Marshall
patent: 3771973 (1973-11-01), Miller
patent: 3984598 (1976-10-01), Sarazin et al.
patent: 4191800 (1980-03-01), Holtzman
patent: 4886699 (1989-12-01), Carroll et al.
patent: 4997516 (1991-03-01), Adler
Patent Abstracts of Japan, vol. 017, No. 415 (E-1407) Aug. 3, 1993 & JP-A-05 082 590 (Mitsui Mining & Smelting Co) Apr. 2, 1993.

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