Copper-clad laminate

Details Copper-clad laminate Copper-clad laminate

2011-08-16

2011-08-16

Nakarani, D. S. (Department: 1787)

Stock material or miscellaneous articles

Structurally defined web or sheet

Continuous and nonuniform or irregular surface on layer or...

C156S308200, C156S309600, C428S450000, C428S451000, C428S458000, C428S473500

Reexamination Certificate

active

07998553

ABSTRACT:
A copper-clad laminate is composed of a copper foil and an aromatic polyimide film placed thereon, in which the copper foil is bonded to the polyimide film at a bonding strength of ≧500 N/m and the polyimide film shows a light transmittance of ≧40% for a light of wavelength of 600 nm and a haze of ≧30% [the light transmittance and haze are values measured after the copper foil is removed by etching].

REFERENCES:
patent: 4916009 (1990-04-01), Hino et al.
patent: 6251507 (2001-06-01), Yamamoto et al.
patent: 6379784 (2002-04-01), Yamamoto et al.
patent: 6699572 (2004-03-01), Yamamoto et al.

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