Etching a substrate: processes – Nongaseous phase etching of substrate – Etching inorganic substrate
Patent
1994-10-11
1997-05-20
Tung, T.
Etching a substrate: processes
Nongaseous phase etching of substrate
Etching inorganic substrate
216105, 252 792, 252 794, C09K 1306
Patent
active
056309503
ABSTRACT:
A process and aqueous bath for bright dipping of a copper containing substrate. The bath includes: an acid, hydrogen peroxide and a bath soluble, peroxide stable constituent effective for creation and stabilization of a dissolution inhibiting film over the brightened substrate.
REFERENCES:
patent: 3773577 (1973-11-01), Shibasaki et al.
patent: 4022703 (1977-05-01), Bakes et al.
patent: 4233111 (1980-11-01), Valayil et al.
patent: 4238279 (1980-12-01), Tsubai et al.
patent: 4308091 (1981-12-01), Schmitt et al.
patent: 4376057 (1983-03-01), Angelo et al.
patent: 4437929 (1984-03-01), Wong
patent: 4518519 (1985-05-01), Lott et al.
patent: 4767661 (1988-08-01), Battey et al.
patent: 4859281 (1989-08-01), Goltz
patent: 4875972 (1989-10-01), Williams et al.
patent: 4880495 (1989-11-01), Petraitis et al.
patent: 5030373 (1991-07-01), Kimura et al.
patent: 5098517 (1992-03-01), Tytgat et al.
"GAF Polyvinylpyrrolidone Polymers" Brochure.
Enthone-OMI Inc.
Tung T.
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