Copper body power hybrid package and method of manufacture

Details Copper body power hybrid package and method of manufacture Copper body power hybrid package and method of manufacture

1983-04-01

1985-03-19

Grimley, A. T.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

29588, 219121ED, 219121LD, 357 74, 357 75, H05K 504

Patent

active

045061084

ABSTRACT:
A hybrid microcircuit package especially for high power microcircuits comprises a hard copper base with integral packaged sidewalls, a sealing frame of Kovar or stainless steel is electron beam welded or laser welded to the top surface of said sidewalls, whereby to highly localize the high temperature at the wall tops and not anneal to the remainder of the copper base. A Kovar or stainless steel lid is conventionally sealed to the frame.

REFERENCES:
patent: 3176382 (1965-04-01), Dickson, Jr. et al.
patent: 4266089 (1981-05-01), Scherer
patent: 4400870 (1983-08-01), Islam

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