Copper-based paste containing refractory metal additions for den

Details Copper-based paste containing refractory metal additions for den Copper-based paste containing refractory metal additions for den

1994-06-10

1996-04-30

Thomas, Laura

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

H05K 109

Patent

active

055127118

ABSTRACT:
A copper-based paste for multilayer ceramic substrate vias and lines including copper particles as the majority constituent of the paste, a refractory metal additive selected from the group consisting of chromium, tantalum, and tungsten, and organic materials. This copper-based paste has particular applicability to the formation of vias and lines in ceramic packages wherein the vias and lines would have a composition principally of copper with additions of the refractory metal.

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