Copper-based metal polishing solution and method for manufacturi

Details Copper-based metal polishing solution and method for manufacturi Copper-based metal polishing solution and method for manufacturi

1996-06-04

2000-04-04

McCamish, Marion E.

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

438691, 438692, 216 88, 216 89, 252 791, B44C 122

Patent

active

060461101

ABSTRACT:
A copper-based metal polishing solution comprises a water-soluble organic acid capable of reaction with copper to form a copper complex compound which is unlikely to be dissolved in water and has a mechanical strength lower than that of copper. The polishing solution also contains polishing abrasive grains and water. The polishing solution of the particular composition does not dissolve at all copper or a copper alloy when a copper or copper alloy film is immersed in the polishing solution, and permits polishing the copper or copper alloy film at a practical rate in the polishing step.

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