Compositions – Etching or brightening compositions
Reexamination Certificate
2005-03-01
2005-03-01
Norton, Nadine G. (Department: 1765)
Compositions
Etching or brightening compositions
C252S079400, C438S692000
Reexamination Certificate
active
06861010
ABSTRACT:
The copper-based metal polishing composition causes Cu or Cu alloy not to be dissolved at all in immersing Cu or Cu alloy therein, and makes it possible to polish Cu or Cu alloy at a high rate in polishing treatment. Such a copper-based metal polishing composition comprises a water-soluble first organic acid capable of reaction with copper to produce a copper complex compound which is substantially insoluble in water and has a mechanical strength lower than that of copper, at least one second organic acid selected from an organic acid having a single carboxyl group and a single hydroxyl group and oxalic acid, an abrasive grain, an oxidizing agent, and water.
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Cho Toshitsura
Hirabayashi Hideaki
Kato Katsuhiro
Saito Akiko
Sakurai Naoaki
Kabushiki Kaisha Toshiba
Norton Nadine G.
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
Tama Chemicals Co. Ltd.
Umez-Eronini Lynette T.
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