Copper-based alloy having a high electrical conductivity and a h

Details Copper-based alloy having a high electrical conductivity and a h Copper-based alloy having a high electrical conductivity and a h

1999-06-10

2000-11-21

Ip, Sikyin

Metal treatment

Process of modifying or maintaining internal physical...

With casting or solidifying from melt

29827, 148685, C22F 108

Patent

active

06149741&

ABSTRACT:
A method for forming supports for use in electronic components. A plate of copper-based alloy including from 0.1 to 1.0% by weight nickel, and from 0.005 to 0.1% by weight of phosphorus is melted and cast. The alloy includes fine precipitates of nickel phosphides throughout the copper matrix. The plate is subjected to a series of deformation operations including, rolling and intermediate annealing at a temperature in the range of 400.degree. to 600.degree. C., with the annealing temperature being maintained for two to four hours, thereby maximizing the production of fine precipitates of nickel phosphides within the alloy. After alloy formation, the plate is coated with a layer of nickel, cut into a desired shape, and secured to an electronic component.

REFERENCES:
patent: 2375285 (1945-05-01), Crampton
patent: 4466939 (1984-08-01), Kim
patent: 4620885 (1986-11-01), Igata
patent: 5334346 (1994-08-01), Kim

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