Copper based alloy for wear resistant sliding layer and sliding

Alloys or metallic compositions – Copper base – Nickel containing

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

420473, 420474, 420475, 420479, C22C 3000, C22C 900

Patent

active

053466683

ABSTRACT:
A Cu-based wear-resistant alloy of a sliding material consists essentially of, by weight, 10-35% Zn, 2-20% Pb, 1-10% Ni, 0.1-1% B and, as required, 0.5-10% of Sn. The alloy can be used under severe conditions of use at elevated speed and temperature with reduced risk of seizure and corrosion. The alloy can be produced by mixing Pb powder and Ni--B alloy powder with Cu--Zn powder or Cu--Zn--Sn alloy powder, or mixing Ni--B alloy powder with Cu--Zn--Pb alloy powder or Cu--Zn--Sn--Pb alloy powder. The alloy can be compacted and sintered to form a sliding member or a composite sliding member is obtained by sintering and integrating the alloy on a steel backing plate optionally having a surface plated with copper.

REFERENCES:
patent: 4206268 (1980-06-01), Roemer et al.
patent: 4505987 (1985-03-01), Yamada et al.
patent: 4632806 (1986-12-01), Morikawa et al.
patent: 5183637 (1993-02-01), Tanaka et al.
patent: 5246509 (1993-09-01), Kato et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Copper based alloy for wear resistant sliding layer and sliding does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Copper based alloy for wear resistant sliding layer and sliding , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Copper based alloy for wear resistant sliding layer and sliding will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1118704

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.