Copper-based alloy

Alloys or metallic compositions – Copper base – Tin containing

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Details

420473, 420476, C22C 09, H01L 2348

Patent

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046279601

ABSTRACT:
A copper-based alloy for use in electrical and electronic devices, particularly as a material used for forming lead frames of semiconductor devices, which is less expensive than phosphor bronze while providing a mechanical strength and durability to repeated bending comparable with those of phosphor bronze, and also a relatively high conductivity. The inventive alloy is a copper-based alloy containing 1.2 to 2.5 wt % tin, 0.01 to 0.15 wt % phosphorous, 0.1 to 0.6 wt % nickel, 0.05 to 1 wt % zinc, and the remainder being copper and minute amounts of unavoidable impurities.

REFERENCES:
patent: 4486250 (1984-12-01), Nakajima

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