Copper-base solder

Details Copper-base solder Copper-base solder

1975-08-06

1977-04-05

Steiner, Arthur J.

Specialized metallurgical processes, compositions for use therei

Processes

Free metal or alloy reductant contains magnesium

75161, 75164, 148 32, C22C 905

Patent

active

040159485

ABSTRACT:
A copper-base ternary alloy is provided which has a melting point lying between those of so-called hard and soft solders, exhibits excellent mechanical properties and is usable to advantage as a joining material to form mechanically reliable joints. The melting point of the alloy can be modified somewhat by changing its zinc content.

REFERENCES:
patent: 2482423 (1949-09-01), Malcolm
patent: 3676088 (1972-07-01), Pryor
"Constitution of Binary Alloys", Hansen-McGraw-Hill Book Co., 1958, 2nd Edition, pp. 596-599.
Transactions of AIME, 1947, vol. 171, pp. 105-117.
Transactions of the Indian Institute of Metals, 9/66; pp. 141 & 142.

Affiliated with

Also associated with

Rating

Copper-base solder does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Copper-base solder, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Copper-base solder will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2264160