Copper-base alloys for leadframes

Details Copper-base alloys for leadframes Copper-base alloys for leadframes

1985-03-01

1986-09-16

Rutledge, L. Dewayne

Alloys or metallic compositions

Copper base

Tin containing

420473, 420476, 420481, 420484, 420485, 420486, 420487, 420488, 420492, C22C 906

Patent

active

046121676

ABSTRACT:
A copper-base alloy for leadframes comprising 0.8-4.0 weight % of Ni, 0.2-4.0 weight % of Ti, and balance Cu and inevitable impurities, the ratio of Ni to Ti being 1-4. It may also comprise 0.1-2.0 weight % of Zn. It may further comprise 0.01-2.0 weight % of at least one of Fe and Co and 0.005-0.5 weight % of at least one element selected from the group consisting of Al, Si, Mn and Mg. The copper-base alloy has good electric conductivity and high mechanical strength. It further has good solderability and solder durability.

REFERENCES:
patent: 2752242 (1956-06-01), Holzwarth
patent: 4366117 (1982-12-01), Tsuji

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