Copper-base alloys for leadframes

Details Copper-base alloys for leadframes Copper-base alloys for leadframes

1986-08-22

1988-03-22

Rutledge, L. Dewayne

Alloys or metallic compositions

Copper base

Nickel containing

420487, 420492, 420493, 420494, 428620, 357 67, 357 70, C22C 906

Patent

active

047327332

ABSTRACT:
A copper-base alloy for leadframes consisting essentially of 0.8-4.0 weight % of Ni, 0.2-4.0 weight % of Ti and 0.05-0.6 weight % of Mg, the balance being essentially Cu and inevitable impurities, and a ratio of Ni to Ti being 1-4. This copper-base alloy has high mechanical strength of about 50 kgf/mm.sup.2 or more and electric conductivity of 30% IACS or more as well as good solderability and solder durability. Thus, it may be used as a highly reliable material for leadframes of semiconductor devices.

REFERENCES:
patent: 4337089 (1982-06-01), Arita et al.
patent: 4366117 (1982-12-01), Tsuji
patent: 4612167 (1986-09-01), Watanabe et al.

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