Copper base alloy for leads of integrated circuit

Details Copper base alloy for leads of integrated circuit Copper base alloy for leads of integrated circuit

1979-11-13

1981-02-10

Skiff, Peter K.

Specialized metallurgical processes, compositions for use therei

Processes

Free metal or alloy reductant contains magnesium

75154, C22C 902

Patent

active

042499410

ABSTRACT:
A copper base alloy for leads of an integrated circuit consisting essentially of from 0.5 to 1.5% by weight of iron, from 0.5 to 1.5% by weight of tin, from 0.01 to 0.35% by weight of phosphorus, and the balance of copper and inevitable impurities. Said alloy possesses satisfactory properties which are required of leads of integrated circuits.

REFERENCES:
patent: 2128955 (1938-09-01), Montgomery
patent: 2210670 (1940-08-01), Kelly
patent: 3639119 (1972-02-01), McLain
patent: 3698965 (1972-10-01), Ence
patent: 3923558 (1975-12-01), Shapiro et al.
Temple, "Recent Developments in Properties and Protection of Copper for Electrical Uses", Metallurgical Reviews, vol. 11, 1966, pp. 47-49.

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