Copper-base alloy and its use

Details Copper-base alloy and its use Copper-base alloy and its use

2007-03-06

2007-03-06

Zimmerman, John J. (Department: 1775)

Alloys or metallic compositions

Copper base

Aluminum, gallium, indium, or thallium containing

C420S490000, C420S492000, C420S495000, C420S469000

Reexamination Certificate

active

10921888

ABSTRACT:
A copper-base alloy with increased melting point above 1000° C., which is resistant or immune to carburization, metal dusting and coking, resistant to oxidation at elevated temperatures. The alloy has the following composition (in weight-%): Al 4–15, Si 0.1–6, Mo 0.5–40, W 0–40, where the total of Mo and W do not exceed 40%, one or more of the group of Rare Earth Metals (REM), such as yttrium, hafnium, zirconium, lanthanum and/or cerium, up to 1.0 weight-% of each element or a total of maximum 3.0 weight-%, Cu balance and normally occurring alloying additions and impurities. A method for the alloy's production, and the alloy's use as construction components in CO-containing atmospheres, ammonia containing atmospheres, and/or hydrocarbon containing atmospheres or solid carbon containing processes, are also disclosed.

REFERENCES:
patent: 2778733 (1957-01-01), Frejacques
patent: 4071359 (1978-01-01), Cheskis et al.
patent: 5207821 (1993-05-01), Ikenoue et al.
patent: 5445686 (1995-08-01), Ueshima et al.
patent: 6737175 (2004-05-01), Ramanarayanan et al.
patent: 7041252 (2006-05-01), Szakalos et al.
patent: 2004/0005239 (2004-01-01), Szakalos et al.
patent: 2005/0079378 (2005-04-01), Lundberg et al.
patent: 2005/0173300 (2005-08-01), Szakalos et al.
patent: 02-118041 (1990-05-01), None
patent: 02-166246 (1990-06-01), None
patent: 03-291343 (1991-12-01), None
patent: 10-158766 (1998-06-01), None
patent: 2001-240924 (2001-09-01), None
patent: WO 03/072836 (2003-09-01), None
“Phase Diagrams of Binary Alloy Systems”,Metals Handbook, 8thEd., vol. 8, Metallography, Structures and Phase Diagrams, American Society for Metals, Metals Park, Ohio, 1973, p. 259.
Lundberg et al., U.S. Appl. No. 10/921,943, filed Aug. 20, 2004 entitled “Metal Dusting Resistant Product”.

Affiliated with

Also associated with

Rating

Copper-base alloy and its use does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Copper-base alloy and its use, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Copper-base alloy and its use will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3790964