Chemistry: electrical and wave energy – Apparatus – Electrolytic
Patent
1997-08-07
1999-06-01
Valentine, Donald R.
Chemistry: electrical and wave energy
Apparatus
Electrolytic
204282, 204290R, 204286, 204293, 204287, 204279, C25C 700, C25D 1702
Patent
active
059085401
ABSTRACT:
A process and assembly for stabilizing organic additives in an electrolytic solution while electroplating copper. The process includes forming a protective film on a first surface of an anode and minimizing contact between the electrolytic solution and a second surface of the anode which is further from the cathode than the first surface. An anode housing is used to minimize contact between the electrolytic solution and the second surface of the anode. The housing includes two side walls and a bottom wall, each having a groove, and a sealing back plate. The anode is fitted in the grooves such that the first surface of the anode is in contact with the electrolytic solution and the second surface of the anode abuts against the sealing back plate. The anode housing may be used in an electroplating system including the anode housing, a plating tank containing the electrolytic solution, a cathode immersed in the electrolytic solution, and an anode, which preferably is in the shape of a slab.
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Blecker Ira D.
International Business Machines - Corporation
Valentine Donald R.
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