Copper and copper alloy etching solutions and process

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

252 794, C23F 100, C09K 1306

Patent

active

039363325

ABSTRACT:
This invention provides cooper and copper alloy etching solutions comprising a mixed aqueous solution of a peroxysulfate with a diazine compound and a halogen compound added as the catalyst. There is also provided a process for etching copper and copper alloys with said etching solutions.

REFERENCES:
patent: 3410802 (1968-11-01), Radimer et al.
patent: 3770530 (1973-11-01), Fujimoto

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