Copper alloys for suppressing growth of Cu-Al intermetallic comp

Details Copper alloys for suppressing growth of Cu-Al intermetallic comp Copper alloys for suppressing growth of Cu-Al intermetallic comp

1983-01-13

1985-02-05

Truhe, J. V.

Electricity: electrical systems and devices

Miscellaneous

428652, 29589, H01R 462, H01R 909, H01B 102

Patent

active

044981210

ABSTRACT:
Copper alloys are disclosed which may be bonded to aluminum containing members with reduced formation of undesirable copper-aluminum intermetallic compounds. The copper alloys consist essentially of about 15% to about 30% nickel and the balance essentially copper. The nickel addition in the alloys suppresses the nucleation rate and the subsequent growth rate of copper-aluminum intermetallic compounds. The copper alloys of the instant invention have particular utility in integrated circuit assemblies as lead frames, lead wires and beam lead tapes.

REFERENCES:
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patent: 4337089 (1982-06-01), Arita et al.
patent: 4441118 (1984-03-01), Fister et al.
"Striped CA 724 (9% Nickel) Puts Gold in its Place and Saves Money Doing It," Nickel Topics, p. 8.

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