Copper alloys for electrical and electronic parts

Alloys or metallic compositions – Radioactive – Iron base

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420487, 420494, 420499, C22C 900

Patent

active

053343468

ABSTRACT:
This invention relates to a high performance copper alloy and its manufacturing methods for electrical and electronic parts which have good electrical conductivity, superior mechanical properties, and high thermal stability of tin-lead plating. The copper alloy consisting essentially of copper and from copper-nickel-silicon-phosphor-magnesium alloys for semiconductor leadframe alloys consisting essentially of copper and from 0.5 to 2.4% by weight nickel, from 0.1 to 0.5% by weight silicon, from 0.02 to 0.16% by weight phosphorus, and from 0.02 to 0.2% by weight magnesium.

REFERENCES:
patent: 3522039 (1970-07-01), McLain
patent: 4466939 (1984-08-01), Kim et al.
patent: 4594221 (1986-06-01), Caron et al.
patent: 4728372 (1988-03-01), Caron et al.
patent: 5248351 (1993-09-01), Kubozono et al.

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