Copper alloy wire, and insulated electric wires and multiple cor

Details Copper alloy wire, and insulated electric wires and multiple cor Copper alloy wire, and insulated electric wires and multiple cor

1991-01-25

1992-04-21

Zimmerman, John

Stock material or miscellaneous articles

All metal or with adjacent metals

Foil or filament smaller than 6 mils

148 115C, 148432, 174110SR, 174117F, C22C 900, C22F 108, H01B 102

Patent

active

051067013

ABSTRACT:
A copper alloy wire has a composition composed of no less than 0.01% by weight of Ag and balance Cu and unavoidable impurities. The copper alloy wire has been prepared by drawing a wire stock having the composition at a reduction ratio of no lower than 40% and subjecting the wire stock to heat treatment for half annealing to have a tensile strength of no lower than 27 kg.multidot.f/mm.sup.2 and an elongateion of 5%. An insulated elecric wire includes the copper alloy wire as a conductor and an insulation layer covering the wire. Also, a multiple core parallel bonded wire includes two or more such insulated electric wires bonded parallel to each other.

REFERENCES:
patent: 2559031 (1951-07-01), Sykes
patent: 4059437 (1977-11-01), Nesslage et al.
patent: 4726559 (1988-02-01), Hosoda et al.
patent: 4734254 (1988-03-01), Nippert
W. Hodge et al., "New Copper-Base Alloys Combine High Strength with High Conductivity", Materials & Methods, Jan. 1950, pp. 64-65.
Patent Office of Japan File suppliers JAPS & JPA62118737 (Toshiba) *abstract*.
Patent Office of Japan File Suppliers JAPS & JPA1313121 (Showa Electric) *abstract*.
S. Takahashi et al., "New High Performance Parallel Bonded Fine Enamalled Wire for Hard Disk Drive Head", 1989 IEEE, pp. 173-179.

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