Metal treatment – Process of modifying or maintaining internal physical... – Heating or cooling of solid metal
Reexamination Certificate
2003-02-06
2010-06-01
Ip, Sikyin (Department: 1793)
Metal treatment
Process of modifying or maintaining internal physical...
Heating or cooling of solid metal
Reexamination Certificate
active
07727344
ABSTRACT:
A copper alloy suitable for an IC lead pin for a pin grid array provided on a plastic substrate, which copper alloy is a Cu—Zn—Mg alloy, a Cu—Sn alloy, a Cu—SN—Ag alloy, a Cu—Fe—Zn—P alloy, or a Cu—Cr alloy, each having a given alloy composition, in which the copper alloy has conductivity of 50% IACS or more and tensile stress of 400 MPa to 650 MPa.
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Miyoshi Takashi
Saito Tsutomu
Takahashi Isao
Birch & Stewart Kolasch & Birch, LLP
Ip Sikyin
The Furukawa Electric Co. Ltd.
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