Metal treatment – Stock – Copper base
Reexamination Certificate
2004-02-19
2010-06-22
Ip, Sikyin (Department: 1793)
Metal treatment
Stock
Copper base
C148S426000, C420S470000, C420S471000, C420S489000
Reexamination Certificate
active
07740721
ABSTRACT:
Provided is a copper alloy sputtering target containing 0.01 to (less than) 0.5 wt % of at least 1 element selected from Al or Sn, and containing Mn or Si in a total amount of 0.25 wtppm or less. The above copper alloy sputtering target allows the formation of a wiring material for a semiconductor element, in particular, a seed layer being stable, uniform and free from the occurrence of coagulation during electrolytic copper plating and exhibits excellent sputtering film formation characteristics. A semiconductor element wiring formed with this target is also provided.
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Howson & Howson LLP
Ip Sikyin
Nippon Mining & Metals Co., Ltd
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