Copper alloy lead frame material for semiconductor devices

Details Copper alloy lead frame material for semiconductor devices Copper alloy lead frame material for semiconductor devices

1988-10-12

1989-10-31

Rutledge, L. Dewayne

Alloys or metallic compositions

Copper base

Tin containing

420475, C22C 902

Patent

active

048775770

ABSTRACT:
A copper alloy material for lead frames for semiconductor devices. The lead frame material consists essentially of:

REFERENCES:
patent: 4612167 (1986-09-01), Watanabe et al.

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