Copper alloy having high resistance to oxidation for use in lead

Alloys or metallic compositions – Copper base – Zinc containing

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420480, 420471, 420473, 420481, 420482, C22C 902, C22C 906

Patent

active

046328068

ABSTRACT:
A Cu alloy having high resistance to oxidation for use in leads on semiconductor devices is disclosed. The alloy consists essentially of 7-15 wt % Mn, 10-30 wt % Zn, 0.2-10 wt % Ni, 0.1-3 wt % Al, with the balance being Cu and incidental impurities. Also disclosed is a Cu alloy clad material wherein the substrate is made of Cu or Cu alloy having high electrical conductivity and good heat dissipation, and the cladding or partial cladding is composed of the Cu alloy having the composition specified above.

REFERENCES:
patent: 4242132 (1980-12-01), Shapiro et al.
patent: 4525434 (1985-06-01), Morikawa et al.

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