Copper alloy having high resistance to oxidation for use in lead

Details Copper alloy having high resistance to oxidation for use in lead Copper alloy having high resistance to oxidation for use in lead

1983-09-06

1985-06-25

Skiff, Peter K.

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

428929, C23C 500

Patent

active

045254346

ABSTRACT:
A Cu alloy having high resistance to oxidation for use in leads on semiconductor devices is disclosed. The alloy consists essentially of 7-15 wt % Mn, 10-30 wt % Zn, 0.2-10 wt % Ni, 0.1-3 wt % Al, with the balance being Cu and incidental impurities. Also disclosed in a Cu alloy clad material wherein the substrate is made of Cu or Cu alloy having high electrical conductivity and good heat dissipation, and the cladding or partial cladding is composed of the Cu alloy having the composition specified above.

REFERENCES:
patent: 4366117 (1982-12-01), Tsuji

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