Copper alloy for use as material of heat exchanger

Metal treatment – Stock – Copper base

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

148434, 420472, 420476, 420477, C22C 902

Patent

active

049350765

ABSTRACT:
A copper alloy suitable for use as the material of a heat exchanger contains 1 to 4.5 wt % of Zn, 1.0 to 2.5 wt %, preferably 1.5 to 2.0 wt % of Sn, 0.005 to 0.05 wt %, preferably 0.01 to 0.04% of P, and the balance substantially Cu and inevitable impurities, and has grain size not greater than 0.015 mm, preferably below 0.01 mm. The alloy exhibits high resistance levels to corrosion such as stress corrosion cracking, dezincification corrosion and so forth, as well as superior workability, strength and solder wettability, and, hence, can suitably be used as the materials of the constituents of a heat exchanger such as tanks, tube plates and tubes.

REFERENCES:
patent: 3956027 (1976-05-01), Parikh et al.
patent: 4025367 (1977-05-01), Parikh et al.
patent: 4047978 (1977-09-01), Parikh et al.
patent: 4110132 (1978-08-01), Parikh et al.
patent: 4741394 (1988-05-01), Tanigawa et al.
Standards Handbook, Copper Development Association Inc., 1985, title page, Table of Contents and pp. 8, 98, 99 and 104.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Copper alloy for use as material of heat exchanger does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Copper alloy for use as material of heat exchanger, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Copper alloy for use as material of heat exchanger will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2258517

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.