Copper alloy for use as lead material for semiconductor devices

Details Copper alloy for use as lead material for semiconductor devices Copper alloy for use as lead material for semiconductor devices

1981-06-03

1982-12-28

Skiff, Peter K.

Alloys or metallic compositions

Copper base

Zinc containing

420490, C22C 904

Patent

active

043661173

ABSTRACT:
A copper alloy for use as a lead material for semiconductor devices, which comprises 0.04-1.0% Ni, 0.01-0.3% Si, and 0.05-15% Zn, all by weight, and the remainder Cu and inevitable impurities. The alloy may contain, in addition to these, a total amount of 0.001-1.0% by weight of one or two or more elements as an accessory ingredient or ingredients selected from the group consisting of 0.001-0.1% by weight each of P and As and 0.01-0.5% by weight each of Ti, Cr, Sn, Mn, and Mg.

REFERENCES:
patent: 2027330 (1936-01-01), Wilkins
patent: 2028317 (1936-01-01), Buttesbaugh
patent: 2137282 (1938-11-01), Hensel et al.
patent: 2309100 (1943-01-01), Crampton et al.
patent: 3072508 (1963-01-01), Klement et al.
patent: 3926681 (1975-12-01), Wang
patent: 4015982 (1977-04-01), Saito et al.

Affiliated with

Also associated with

Rating

Copper alloy for use as lead material for semiconductor devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Copper alloy for use as lead material for semiconductor devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Copper alloy for use as lead material for semiconductor devices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1336698