Copper alloy for terminals and connectors and method for making

Metal treatment – Stock – Copper base

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148682, 148683, 420470, 420472, 420476, C22C 902, C22C 904

Patent

active

061361046

ABSTRACT:
A copper alloy which is adapted for use as terminals and connectors, which comprises from 0.1 wt % to less than 0.5 wt % of Ni, from larger than 1.0 wt % to less than 2.5 wt % of Sn, from larger than 1.0 wt % to 15 wt % of Zn, and further comprises from at least one element selected between from 0.0001 wt % to less than 0.05 wt % of P and from 0.0001 wt % to 0.005 wt % of Si, and the balance being Cu and inevitable impurities The alloy has an electrical conductivity of 90% or below relative to a maximum electrical conductivity of an annealed copper alloy and an area ratio of insoluble matters such as precipitates is 5% or below.

REFERENCES:
patent: 4591484 (1986-05-01), Miyafuji et al.
patent: 4656003 (1987-04-01), Miyafuji et al.
patent: 4687633 (1987-08-01), Miyafuji et al.

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