Copper alloy for fine pattern lead frame

Details Copper alloy for fine pattern lead frame Copper alloy for fine pattern lead frame

1993-12-03

1995-06-13

Roy, Upendra

Alloys or metallic compositions

Copper base

Tin containing

420481, 420487, 148433, 148434, 148435, C22C 905, C22C 906

Patent

active

054240301

ABSTRACT:
A copper alloy contains beryillium ranging from 0.2 to 0.7% in weight, nickel ranging from 0.1% to 2% in weight, and the balance copper and incidental impurities. Preferably, the incidental impurities include sulfur. A first preferable additional substance includes cobalt, zirconium or iron. A second preferable substance includes tin or zinc. A lead frame with a fine lead pattern is formed from a sheet of the copper alloy without burr, thereby improving the production yield of the lead frame.

REFERENCES:
patent: 4657601 (1987-04-01), Guha
patent: 4792365 (1988-12-01), Matsui et al.

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