Copper alloy for electronic machinery and tools and method...

Metal working – Method of mechanical manufacture – Combined manufacture including applying or shaping of fluent...

Reexamination Certificate

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Details

C029S592100, C148S536000, C148S554000, C428S612000, C428S674000, C428S675000

Reexamination Certificate

active

07946022

ABSTRACT:
A copper alloy for electronic machinery and tools, having a surface layer of a work affected layer whose thickness is 0.2 μm or below; and a method of producing the same.

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Japanese Office Action dated Jul. 1, 2008, issued in corresponding Japanese Patent Application No. 200-184940.
Shiga, A. et al; “Analysis on Electroplatability of Copper and Copper Alloys in Relation to their Surface Characterization”; Journal of the Japan Copper and Brass Research Association, Japan, Oct. 1, 1982, vol. 21, pp. 64-76.
International Search Report dated Aug. 8, 2006 of PCT/JP2006/313305.

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