Copper alloy for electronic instruments and method of manufactur

Details Copper alloy for electronic instruments and method of manufactur Copper alloy for electronic instruments and method of manufactur

1986-08-26

1988-03-22

Rutledge, L. Dewayne

Alloys or metallic compositions

Copper base

Tin containing

420485, 148433, 148435, C22C 906

Patent

active

047327316

ABSTRACT:
A copper alloy is disclosed, which contains 0.1 to 3.0 wt % of Ni, 0.1 to 1.0 wt % of Ti, the ratio of Ni to Ti being 4.ltoreq.Ni/Ti thereby, 0.1 to 6.0 wt % of Sn, and 0.005 to 3.0 wt % in total of one or more elements selected from the group consisting of Zn, Mn, Mg, Ca, RE, B, Sb, Te, Si, Co, Fe, Zr, Ag, Mm and Al, and consists of the remainder of Cu and the inevitable impurities. The method for the manufacture of the alloy is characterized in that, after copper alloy ingot was maintained and homogenized for 0.5 to 15 hours at 750.degree. to 960.degree. C. prior to rolling, the hot rolling is carried out starting from a temperature of 700.degree. to 880.degree. C. and the cooling is made immediately after the end of rolling.

REFERENCES:
patent: 4601879 (1986-07-01), Durrschnabel et al.
patent: 4612167 (1986-09-01), Watanabe et al.

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