Stock material or miscellaneous articles – All metal or with adjacent metals – Foil or filament smaller than 6 mils
Patent
1995-09-15
1997-10-28
Zimmerman, John
Stock material or miscellaneous articles
All metal or with adjacent metals
Foil or filament smaller than 6 mils
428612, 428626, 428461, 174254, 174256, B32B 1508, B32B 1520, H05K 109
Patent
active
056816626
ABSTRACT:
A flexible circuit to interconnect two components of an electrical device is formed with a flexible polymeric substrate. A copper alloy is laminated to the flexible substrate. This copper alloy is processed to have relatively high strength, an ultimate tensile strength in excess of about 80 ksi, by either alloying additions, by processing or by a combination of the two. When such an alloy is laminated to the polymeric substrate, the resultant flexible circuit has improved (more cycles to failure) dynamic fatigue performance when compared to both pure copper and dilute copper alloys.
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Caron Ronald N.
Chen Szuchain
Cheskis Harvey P.
Scheuneman James A.
Slusar Richard J.
Olin Corporation
Rosenblatt Gregory S.
Zimmerman John
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