Copper alloy foil

Details Copper alloy foil Copper alloy foil

2005-09-06

2005-09-06

Zimmerman, John J. (Department: 1775)

Stock material or miscellaneous articles

All metal or with adjacent metals

Foil or filament smaller than 6 mils

C428S607000, C428S687000, C428S457000, C428S416000

Reexamination Certificate

active

06939620

ABSTRACT:
For a three-layer flexible board, there is provided a copper alloy foil that requires no roughening processing, that has good adhesion with an adhesive containing an epoxy resin, that can be laminated to form a copper-clad laminate, that has a low surface roughness, and that has high conductivity and strength. The copper alloy of the foil contains at least one of 0.01-2.0 weight percent Cr and 0.01-1.0 weight percent Zr or contains 1.0-4.8 weight percent Ni and 0.2-1.4 weight percent Si. Good adhesion of the copper alloy foil to a resin substrate with an adhesive containing an epoxy resin is obtained by setting the thickness of the anticorrosive coating to less than 3 nm; the surface roughness of the copper alloy foil is below 2 μm expressed as ten-point average surface roughness (Rz); and, without roughening processing, the 180° C. peel strength, after adhesion of the copper alloy foil to the board film by means of an adhesive containing an epoxy resin, is greater than 8.0 N/cm.

REFERENCES:
patent: 07-054079 (1995-02-01), None

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