Copper alloy and method of manufacturing the same

Details Copper alloy and method of manufacturing the same Copper alloy and method of manufacturing the same

2004-09-23

2008-03-04

Ip, Sikyin (Department: 1793)

Alloys or metallic compositions

Copper base

Titanium, zirconium or hafnium containing

C148S432000, C148S433000, C148S434000, C148S435000, C148S436000

Reexamination Certificate

active

07338631

ABSTRACT:
This copper alloy contains at least zirconium in an amount of not less than 0.005% by weight and not greater than 0.5% by weight, includes a first grain group including grains having a grain size of not greater than 1.5 μm, a second grain group including grains having a grain size of greater than 1.5 μm and less than 7 μm, the grains having a form which is elongated in one direction, and a third grain group including grains having a grain size of not less than 7 μm, and also the sum of α and β is greater than γ, and α is less than β, where α is a total area ratio of the first grain group, β is a total area ratio of the second grain group, and γ is a total area ratio of the third grain group, based on a unit area, and α+β+γ=1.

REFERENCES:
patent: 3366477 (1968-01-01), Eichelman, Jr. et al.
patent: 3830644 (1974-08-01), Watanabe et al.
patent: 5582281 (1996-12-01), Nakashima et al.
patent: 6093499 (2000-07-01), Tomioka
patent: 2002/0015657 (2002-02-01), Dong
patent: 2002/0155021 (2002-10-01), Nagai
patent: 2003/0095887 (2003-05-01), Dong
patent: 2004/0140022 (2004-07-01), Inohana et al.
patent: 2004/0159375 (2004-08-01), Yamagishi
patent: 1180917 (2002-02-01), None
patent: 61-041736 (1986-02-01), None
patent: S62-189738 (1987-08-01), None
patent: 63312936 (1988-12-01), None
patent: 2270946 (1990-06-01), None
patent: 2270946 (1990-11-01), None
patent: 03-243736 (1991-10-01), None
patent: 04-165055 (1992-06-01), None
patent: H07-258804 (1995-10-01), None
patent: 08-218155 (1996-08-01), None
patent: 9087814 (1997-03-01), None
patent: 10-060562 (1998-03-01), None
patent: 10081927 (1998-03-01), None
patent: 200282156 (2000-10-01), None
patent: 2000282156 (2000-10-01), None
patent: 2001131661 (2001-05-01), None
patent: 2002-356728 (2002-12-01), None
Furukawa, Horita, Nemoto, TG. Landon: Metal, 70, 11 (2000), pp. 971.
Microstructure and Mechanical Properties of Pure Copper by Accumulative Roll-Bonding(ARB)Process, Journal of the JRICu vol. 41, No. 1 (2002).
Takagi, Kimura: Material, 34, 8 (1995), pp. 959.
Preliminary Manuscript of 42nd Lecture of Japan Research Institute for Advanced Copper-Base Materials and Technologies, pp. 55, (2002).
Office Action dated Oct. 24, 2005 for the Taiwanese counterpart of the present U.S. patent application.
Office Action dated Jun. 30, 2006 for China Patent Application No. 200410086915.5 and English translation.
Office Action dated Apr. 27, 2006 for Korean Patent Application No. 10-2004-0083918 including an English translation of the portion of the Office Action describing the differences between the present invention and Japanese Publication No. H07-258804.

Affiliated with

Also associated with

Rating

Copper alloy and method of manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Copper alloy and method of manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Copper alloy and method of manufacturing the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3964702