Compositions: coating or plastic – Coating or plastic compositions – Metal-depositing composition or substrate-sensitizing...
Reexamination Certificate
2005-04-05
2005-04-05
Klemanski, Helene (Department: 1755)
Compositions: coating or plastic
Coating or plastic compositions
Metal-depositing composition or substrate-sensitizing...
C427S098300, C427S304000, C427S305000, C427S306000, C427S437000, C427S443100, C438S689000
Reexamination Certificate
active
06875260
ABSTRACT:
The present invention is directed to an activator solution and method for activating a copper-seeded surface to facilitate plating of copper onto the copper-seeded surface. The activator solution is prepared by heating a precursor solution to a temperature of at least about 95° C., and maintaining the precursor solution at said temperature for at least about 30 minutes, wherein the precursor solution comprises water, chlorine ions, copper ions, tin (II) ions, and an antioxidant compound which substantially prevents the oxidation of the tin (II) ions to tin (IV) ions.
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Enthone Inc.
Klemanski Helene
Senniger Powers
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