Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – From carboxylic acid or derivative thereof
Patent
1984-09-14
1985-11-26
Anderson, Harold D.
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
From carboxylic acid or derivative thereof
525184, 5253341, 525374, 525375, 525379, 525382, 525426, 528288, 528292, 528310, 528345, C08G 6902, C08G 6914, C08G 6926, C08G 6300
Patent
active
045555664
DESCRIPTION:
BRIEF SUMMARY
DESCRIPTION
TECHNICAL FIELD
The present invention relates to a new copolymer polyamide resin having low water absorption.
BACKGROUND ART
As is well known, polyamide resins find use in fibers and other broad application areas. However, they suffer from disadvantages that the dimensional stability of their moldings is poor and their electrical and other properties are greatly affected by moisture, because they have inherently high water absorption due to their structure having the amide bond. The effect of moisture on the electrical properties is important, for example, in the field where polyamides are used as a heat-sensitive element or a temperature fuse for the heating element of electric blankets and electric carpets on account of their characteristics that their impedance varies depending on the temperature and they have a sharp melting point inherent in crystalline polymers. Therefore, for such applications there are used nylon 11 and nylon 12 which are comparatively low in water absorption among the class of polyamide resins. Nevertheless, they are still susceptible to moisture and no satisfactory performance has been obtained.
DISCLOSURE OF INVENTION
It is the object of the present invention to provide a new copolymer polyamide resin improved in water absorption, which is an inherent disadvantage of polyamide, and improved in mechanical properties, moldability, and flexibility inherent in polyamide resin.
That is to say, the present invention relates to a new copolymer polyamide resin which comprises copolymerized therein 99 to 5 parts by weight of polyamide polymer component having at least one kind of repeating unit represented by the formula (1) or (2) below and 1 to 95 parts by weight of polyolefin component having a number average molecular weight of 500 to 10,000, both terminals of said polyolefin being carboxylic acid groups, amino groups, or hydroxyl groups. group, phenylene group, or cyclohexylene group; and Y is C.sub.l H.sub.2l (l is an integer from 4 to 10), phenylene group, or cyclohexylene group.)
The present invention also covers the following copolymer polyamide resins. That is, a copolymer polyesteramide resin composed of the following constituent units (A), (B), and (C). repeating units represented by the above formula (1) or (2). from 500 to 10,000 with the double bond hydrogenated and the terminals connected to oxygen) bond, the constituent units (A) and (C) are connected through the ester bond, and the constituent units (B) and (C) are connected through the ester bond; the constituent unit (C) accounts for 1 to 80 wt%; and the molar ratio of the constituent unit (B) to the constituent unit (C) is 1:1.2 to 1:0.8), and a new copolymer polyamide resin comprising copolymerized therein 99 to 5 parts by weight of polyamide polymeric component having at least one kind of repeating unit represented by the above formula (1) or (2) and 1 to 95 parts by weight of polybutadiene component of number average molecular weight from 500 to 10,000 with the double bond hydrogenated, both terminals of said polybutadiene being carboxylic acid groups or amino groups.
The polyamide polymeric component constituting the copolymer polyamide resin of this invention and having at least one kind of the repeating unit represented by the above formula (1) or (2) is composed of monomers such as caprolactam, lauryl lactam, 11-aminoundecanoic acid, and 12-aminododecanoic acid, which correspond to the formula (1), and hexamethyleneadipamide, hexamethylenesebacamide, and hexamethylenedodecanamide, which correspond to the formula (2), and diamine salts of cyclic dibasic acids such as terephthalic acid and cyclohexanedicarboxylic acid, and dibasic acid salts of diamines such as phenylenediamine, cyclohexanediamine, and isophoronediamine.
The polyolefin component, with both terminals being carboxylic acid groups, amino groups, or hydroxyl groups, which constitutes the copolymer polyamide resin of this invention, is obtained by radical polymerization of at least one kind of olefin monomer using a proper initi
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Arita Koichiro
Suzuki Hajime
Anderson Harold D.
Daicel Chemical Industries Co., Ltd.
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