Copolyetherester hot-melt adhesives

Details Copolyetherester hot-melt adhesives Copolyetherester hot-melt adhesives

1995-08-23

1996-10-01

Szekely, Peter A.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From carboxylic acid or derivative thereof

528301, 528302, 528305, 528308, 5283086, 5283087, C08G 63183, C08G 63672, C08G 6316, C08G 6300

Patent

active

055612130

ABSTRACT:
Hot-melt adhesives are based on a random copolyetherester formed from aromatic dicarboxylic acids, terephthalic acid and isophthalic acid wherein the molar proportion of terephthalic acid is at least 55% based on the acid content, with a butanediol content between 20 and 85 mol % and containing at least 10 mol % triethylene glycol; the remainder of the diol content is preferably diethylene glycol. Copolyetheresters of this type are distinguished by excellent adhesion properties, a low melting point, rapid crystallization, and good resistance to laundering and dry cleaning at a minimum viscosity of 80 Pas.

REFERENCES:
patent: 4130603 (1978-12-01), Tanaka et al.
patent: 4452853 (1984-06-01), Schade et al.
patent: 4540749 (1985-09-01), Meyer, Jr. et al.
patent: 4551521 (1985-11-01), McConnell et al.
Japanese Abstract# J57133217 dated Feb. 3, 1981, "Heat Bonding Co: Fibre . . . Comonomer".
Japanese Abstract# J57095311 dated Jun. 14, 1982, "Copolymerised Polyester Filaments . . . Components".
German Abstract# 159131 dated Dec. 26, 1977, "Polyester Hot Melt Adhesive . . . Heat And Water".

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