Copolyamide melt adhesives for heat sealing textiles

Details Copolyamide melt adhesives for heat sealing textiles Copolyamide melt adhesives for heat sealing textiles

1994-05-27

1995-10-17

Hampton-Hightower, P.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From carboxylic acid or derivative thereof

528315, 528322, 528323, 528324, 528332, 528600, 528606, 525425, 525432, 525436, 526935, C08G 7310

Patent

active

054592305

ABSTRACT:
The use of copolyamides as melt adhesive for heat sealing is disclosed. At least three monomer components are copolymerized in the copolyamide. These monomer components are selected from the following group: an equimolar mixture of adipic acid and hexamethylenediamine (6,6 salt), lauric acid lactam, 11-aminoundecanoic acid, an equimolar mixture of azelaic acid and hexamethylenediamine (6,9 salt), an equimolar mixture of sebacic acid and hexamethylenediamine (6,10 salt) and an equimolar mixture of dodecane dicarboxylic acid and hexamethylenediamine (6,12 salt), the melting point of the copolyamide being lower than 140.degree. C. and at least 10% by weight of lauric acid lactam and/or 11-aminoundecanoic acid being copolymerized.

REFERENCES:
patent: 4030957 (1977-06-01), Raabe et al.
patent: 4093492 (1978-06-01), Raabe et al.
patent: 4459389 (1984-07-01), Mumcu et al.
patent: 4483975 (1984-11-01), de Jong et al.
patent: 4487895 (1984-12-01), Feldmann et al.

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