Copolyamide adhesive containing behenic acid

Details Copolyamide adhesive containing behenic acid Copolyamide adhesive containing behenic acid

1984-08-24

1986-07-22

Anderson, Harold D.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

524284, 528335, 528336, C08L 7700

Patent

active

046020578

ABSTRACT:
The invention concerns a heat-sealing adhesive on the basis of copolyamides for the coating of fabrics, and especially of linings for outerwear. The invention consists of the fact that this heat-sealing adhesive contains from 0.3 to 15% by weight, preferably 0.7 to 12% by weight, of behenic acid. Thereby a substantially and unexpectedly increased adhesion strength of the adhesive is attained, so that for the same adhesive strength a smaller amount of the heat-sealing adhesive is required. This improves the comfort provided by the article of clothing when being worn.
The invention also concerns a process for the manufacture of this heat-sealing adhesive as well as its use for the coating of lining fabrics.

REFERENCES:
patent: 4452931 (1984-06-01), Okamoto et al.

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