Copolyamide adhesive compositions containing asymmetric aliphati

Details Copolyamide adhesive compositions containing asymmetric aliphati Copolyamide adhesive compositions containing asymmetric aliphati

1993-01-26

1994-06-14

Kight, III, John

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From carboxylic acid or derivative thereof

528338, 528339, 5283393, 528340, 528346, 528347, C08G 6926

Patent

active

053211200

ABSTRACT:
Copolyamide adhesive compositions have a diamine component and a dicarboxylic acid component. The diamine component includes the reaction residues of at least two diamines selected from non-cyclic aliphatic diamines, cycloaliphatic diamines, and aromatic diamines. The dicarboxylic acid component includes the reaction residues of at least two dicarboxylic acids selected from non-cyclic aliphatic dicarboxylic acids, cycloaliphatic dicarboxylic acids, and aromatic dicarboxylic acids. One of the residues is mono-alkyl branched asymmetric. The composition is free from aliphatic omega aminocarboxylic acids or lactams having 12 carbon atoms or less. When one of the dicarboxylic acids is a polymerized fatty acid, the diamine component does not contain a cycloaliphatic diamine.

REFERENCES:
patent: 3842046 (1974-10-01), Schmitt et al.
patent: 4476280 (1984-10-01), Poppe et al.
patent: 4566931 (1986-01-01), Panoch et al.
patent: 4617342 (1986-10-01), Poppe et al.
patent: 4853460 (1989-08-01), Harman
patent: 4937322 (1990-06-01), Barthelemy
patent: 5081223 (1992-01-01), Paschke et al.

Affiliated with

Also associated with

Rating

Copolyamide adhesive compositions containing asymmetric aliphati does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Copolyamide adhesive compositions containing asymmetric aliphati, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Copolyamide adhesive compositions containing asymmetric aliphati will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1250159